YCS Character Library Hard Disk BGA Reballing Stencil - EMMC/EMCP/NAND Chip Reballing Tool

YCS Character Library/Hard Disk BGA Reballing Stencil is a precision steel mesh tool built for EMMC, EMCP, and NAND hard disk chip reballing on mobile phone motherboards. It covers 12 ball patterns — 60, 70, 110, 153, 162, 169, 178, 200, 221, 254, 297, and 315 balls — so one stencil handles most Android hard disk IC footprints technicians see on the bench. Model YDZZH9140107067 is designed for GSM repair shops doing dead-after-flash recovery, hard disk IC change, and BGA reballing work where accurate solder ball placement decides whether the chip survives.