This iPhone X welding nozzle is built specifically for QUICK 2008 and QUICK 861DW hot air rework stations. Its shape matches the iPhone X double-layer motherboard exactly, so you get even heat distribution across the board without stressing nearby components. Stainless steel construction gives it long service life on a busy repair bench. Use it to separate the upper and lower logic boards safely while protecting the NAND/PCIe, CPU, WiFi, and baseband ICs from accidental solder bridges. A solid pick for any GSM technician doing iPhone X board-level repair, reballing prep, or dead phone diagnosis.
